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Continuous Developments / Improvements
Avo Tech International offers research in continuous developments and improvements for multi-layered circuit boards.
Influence of Micro-sectioning to Uncover the Impact of Alternative Oxide Coating and Post Treatment on Pink Ring and Delamination of Multilayer Printed Circuit Board
Part B:
Micro-sectioning for PTH Quality Inspection at Avo Tech International Inc.
- Micro-sectioning or Cross-sectioning is a very unique technique of a in depth analysis of PTH (Plated through holes) in printed circuit board manufacture or construction by preparing a section of the board perpendicular to the area of interest or in question. The test section often is pretreated with Thermal shock (280°F) and quenched in cold water to reveal hidden defects (micro-cracks) when micro-sectioned which may not be seen otherwise.
Microscopes for Surface Analysis
- Avo Tech helps its customers with this technology to reveal Pink ring, wedge voids, and delamination problems during the manufacture of Multi-layers printed circuit board.
Fig. 1 – Circuit Board Coupon Cutting, Casting and Mount
Fig. 2 – The mounting process of Multilayer Printed Circuit Board
Fig. 3 – Micro-polishing Machine for Cross Sectioning Process
Fig. 4 PTH Cross Section of No Post Dip or Not Reduced Alpha Prep or alternate Oxide Treated Board
Fig. 6 PTH Cross Section of Fully Reduced MLB
Fig. 8 PTH Torn Hole Wall in Using Worn Out Drill Bit
Fig. 5 PTH Cross Section of Reduced and Re-oxidized by Baking
Fig. 7 PTH of MLB laminated with Warped Platens
